IC Product Engineer

Join our team of technologists, radar specialists, and scientists to make zero road fatalities a reality, for everyone.

We are seeking an IC Product Engineer to drive silicon validation, yield optimization, and product maturity from initial tape-out through high-volume manufacturing. In this role, you will act as the technical bridge between Design, Test, Quality, and Foundry/OSAT partners. You’ll leverage advanced statistical analysis to convert complex ATE data into actionable yield and quality improvements.ng requisitions 'from scratch'

Responsibilities

Yield Learning & Optimization: Drive wafer-level and final test yield enhancement programs. Identify root causes of yield drop, parametric shifts, and low-yield excursions across multiple manufacturing lots.

Data Analysis & Reporting: Use JMP, Spotfire, or similar statistical tools to analyze large-scale ATE data (STDF), perform correlation analysis, establish guard bands, and track yield metrics across OSATs and foundries.

Silicon Validation & Characterization: Partner with Design and Test teams to define characterization plans, perform shmoo plot analysis, evaluate thermal/voltage margins, and establish production test limits.

Production & OSAT Support: Support offshore manufacturing, review yield baseline shifts, drive continuous improvement programs (CIP), and manage product hold disposition rules.

Quality & Reliability: Assist Failure Analysis (FA) and Reliability teams in investigating customer returns (RMA), qualifying new packages/process nodes, and supporting ESD/HTOL/HAST qualification tasks.

Requirements

Experience: Minimum 5+ years of direct experience in IC/Semiconductor Product Engineering (post-silicon bring-up to high-volume production).

Statistical Tools: Demonstrated hands-on proficiency with JMP, Spotfire, or equivalent statistical data analysis engines for handling STDF/wafer map data.

Yield & Parametric Analysis: Deep understanding of statistical process control (SPC), baseline drift detection, capability metrics (Cpk ), and correlation methodologies (wafer vs. package test).

Education: Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Microelectronics, or a related field.