Electronic packaging and electromechanical solutions for MIL hardened sub-systems. Designing complex assemblies while keeping them easy to assemble and simple to repair. Thermal design. Interface with electronic engineers and PCB designers. Responsibility for the entire mechanical manufacturing process – from design to serial production. Design of test equipment and complementary components. Support of production engineering department. Requirements Leading academic institute graduate – mandatory. 6 to 8 years experience in electronic packaging – mandatory. Knowledge and deep understanding of mechanical manufacturing processes such as CNC, milling, routing, turning, flange forming etc. – mandatory. Expert user of CAD programs such Solid Edge. Knowledge of and experience with military and aviation standards such as MIL-STD-810 and RTCA/DO-160 Background in power supply design –
