What we need to see: BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience. 2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing. Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications. Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools. High awareness for quality, robustness, and manufacturability. High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach. Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations. Curious and creative problem solver, well organized and multi-tasker. Ways to stand out of the crowd: Hands-on FEA mechanical simulation experience -
