We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.
Key job responsibilities
Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout — impedance-controlled routing, power plane optimization, and critical net shielding.
Experience identifying bugs in architecture, algorithms, functionality, and performance with strong overall debugging skills
Experience verifying at multiple levels of logic from IP blocks to SoCs to full system testing
5+ years of experience in IC package layout and physical design
Experience executing package designs from concept through tape out for multi-layer organic substrates or silicon interposers
Hands-on experience with package layout tools such as Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, or equivalent
Understanding of advanced packaging technologies: 2.5D/3D-IC, fan-out WLP, RDL, TSV, microbump, or silicon bridge interconnects
Working knowledge of package design rules, DFM constraints, and physical verification methodologies (DRC, connectivity checks)
Experience with bump map and ball map definition, escape routing strategies, and power/ground plane design
Good communication skills with the ability to work effectively across design, SI/PI, and manufacturing teams
Experience with formal verification techniques including abstraction and end-to-end checking
Experience with ARM and various DSP ISAs
Experience with current and upcoming RF standards in cellular (4G/5G NR), WiMAX, 802.11ad, microwave backhaul, or related broadband wireless standards
Experience with industry standard tools and scripting languages (Python or Perl) for automation
MS with 3+ years in IC package layout and physical design
Familiarity with substrate and interposer manufacturing processes, material properties, and their impact on design decisions
Exposure to chiplet-based or heterogeneous integration packaging architectures
Familiarity with package-level SI/PI concepts (impedance control, PDN layout, crosstalk-aware routing) sufficient to collaborate with SI/PI engineers
Experience developing automation scripts (Python, TCL, Skill, Ravel) for layout tasks or design rule checks
Exposure to working with OSAT partners on NPI builds or yield improvement efforts
Familiarity with high-bandwidth memory (HBM) integration in advanced packaging contexts
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