Minimum qualifications: Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience. 8 years of experience in IC silicon quality or reliability. Experience leading the product reliability lifecycle from post-tapeout through high-volume manufacturing. Experience with semiconductor complementary metal-oxide-semiconductor (CMOS) technology, device physics, and failure mechanisms. Preferred qualifications: Master's degree in Electrical Engineering, Materials Science, or related field. Expertise in statistical data analysis using tools such as JMP, Python, or JSL. Knowledge of design-for-reliability (DfR) rules and implementation techniques. Familiarity with electrical failure analysis (EFA) and physical failure analysis (PFA) techniques. Track record with silicon reliability on process nodes and advanced packaging technologies.
