Minimum qualifications: Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field, or equivalent practical experience. 10 years of experience in IC silicon quality or reliability. Experience leading the product reliability life-cycle from post-tapeout through high-volume manufacturing. Experience working with semiconductor Complementary Metal-Oxide-Semiconductor (CMOS) technology, device physics, and failure mechanisms. Preferred qualifications: Master's degree in Electrical Engineering, Materials Science, or related field. Expertise in statistical data analysis using tools such as JMP, Python, or JSL. Familiarity with Electrical Failure Analysis (EFA) and Physical Failure Analysis (PFA) techniques. Proven track record with silicon reliability on process nodes and advanced packaging technologies. Deep knowledge of Design-for-Reliability (DfR) rules and implementation techniques.