Minimum qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience. 8 years of experience in product engineering or test engineering. Experience developing on Advantest 93K or Teradyne UltraFlex ATE platforms. Experience with product engineering, supply chain data analytics, or diagnostics for High Volume Manufacturing (HVM) or NPI. Preferred qualifications: Experience with industry standards, design tools, and DFT best practices, including at-speed TDF, ATPG, MBIST, memory repair, diagnostic tools, and yield improvement. Experience evaluating customer returns with ATE and SLT, identifying coverage gaps, developing incremental structural and functional patterns to address quality issues. Experience delivering HVM screening solutions for high performance computing chips in advanced technology nodes with low Defective Parts Per Million (DPPM). Knowledge of statistical analysis (e.g. JMP), Yield Management Systems (e.g. Exensio, YieldExplorer, JMP), or Python for data analytics.
