Minimum qualifications: Bachelor's degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience. 12 years of experience in Silicon Architecture, Mixed-Signal DSP, Communication Theory, or Systems Engineering. Experience defining architectural specifications for high-bandwidth interconnects. Experience with silicon development from initial concept through to high-volume production (Graphic Design System II (GDSII) to market). Preferred qualifications: Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field. Experience representing organizations in industry standards bodies (e.g., IEEE, OIF, PCIe-SIG, or CXL). Understanding of advanced low power DSP implementation.
